Responsibilities and duties?Reporting to the quality supervisor, the successful candidate will be responsible for products quality improvement, new product development and evaluation.?Responsible for on-site inspection/audit to ensure product conformity with the Company’s Quality Management System (QMS)?Conduct investigation, improvement, analysis of root cause, preventive and corrective action for solving quality problems?Perform investigation, data analysis and trouble-shooting on production process?Handle claims and inspection activities with internal department and suppliers?Prepare and evaluate new development samples, ensure the APQP process with smooth move?Coordinate with internal departments on customer complaints related to quality matters.
1.熟悉PCB或封装基板工艺全流程,精通图形转移或电镀工艺; 熟知sputter工艺尤佳2.有PCB / SUB器件嵌埋产品经验或项目改善专案经验者优先,了解封装领域或wafer bumping process知识者尤佳;3.熟悉FMEA、APQP等常用质量工具,熟练使用JMP/Mini Tab等分析软件;4.有较强的沟通协调能力强和工作主动性。
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